Shenzhen World Exhibition &Convention Center (Bao'an),PR China
Shenzhen World Exhibition &Convention Center (Bao'an),PR China
Mar 10, 2025
π Exciting News Ahead! π
We’re thrilled to invite you to join us at several upcoming exhibitions this year, where we’ll be showcasing our latest and most innovative modifier agents for the rubber, plastics & high-end electronics industries. Whether you're looking for advanced technology to reduce costs or enhance performance, we've got something truly special for you!
π§ What's New?
1. Based on our self-produced N-phenylmaleimide, we've developed a new copolymer—ABS Heat-Resistant Modifier NSM. This product significantly boosts heat resistance and mechanical properties like hardness and tensile strength. By adding just 1% of NSM to ABS, you can increase heat resistance by 1-2°C. When mixed with ABS at 30%, the heat resistance temperature of the resin can reach up to 125°C!
2. Our Bismaleimide (BMI) Series is specially designed for the electronics industry, offering excellent heat resistance with a TG temperature range of 200–300°C and long-term heat resistance between 160–230°C. It also features a low dielectric constant and low dielectric loss, making it an ideal resin material for high-frequency, high-speed circuit boards, copper-clad laminates (CCL), electronic components, and wire insulation layers.
Come visit us and explore reliable products to elevate your business!
π Let’s Connect at These Events:
πΉ #Chinaplas 2025
π April 15-18, 2025
π Shenzhen World Exhibition & Convention Center (Baoan), China