Application
The polyimide films market has been segmented into FPC, specialty fabricated product, pressure sensitive tape, motor / generator and wire & cable. As per the findings of research, FPC held the largest share of the market in terms of both revenue and volume in 2016. Polyimide films are most preferred over other materials such as polycarbonates, epoxy resins, and polyurethanes, for manufacturing FPC owing to its blend of electrical, chemical, mechanical, and thermal properties.
Asia-Pacific held the largest share of the polyimide films market in terms of both revenue and volume in 2016. In Asia-Pacific, PI films are mostly consumed in semiconductor foundries and semiconductor component manufacturing facilities located in Taiwan, China and Japan. In addition, growing usage of PI films based electronics devices among users has created surge in demand for the polyimide films market.
How to make the polyimide film?
Preparation of monomers. The first step is to prepare the monomers, which are the building blocks of polyimide resin. The most common monomers used to make polyimide resin are diamines and dianhydrides. Diamines are compounds with two amino groups, while dianhydrides are compounds with two carboxylic acid groups.
Polycondensation reaction. The monomers are then reacted together in a polycondensation reaction to form poly(amic acid). This reaction is typically carried out in a solvent, such as dimethylformamide (DMF) or N,N-dimethylacetamide (DMAc).
Imidization. The poly(amic acid) is then imidized to form polyimide. This is done by heating the poly(amic acid) to a high temperature, typically in the range of 200-300 degrees Celsius. The imidization reaction is exothermic, so the temperature of the reaction must be controlled carefully.
Film formation. The polyimide can then be cast into a film. This is typically done by dissolving the polyimide in a solvent and then casting the solution onto a substrate. The solvent is then evaporated, leaving behind the polyimide film.
The following are some additional details about the process:
The choice of monomers will affect the properties of the resulting polyimide film. For example, the type of diamine used will affect the film’s thermal stability, while the type of dianhydride used will affect the film’s mechanical properties.
The polycondensation reaction can be carried out in either a solution or a melt phase. The solution phase is more common, as it is easier to control the reaction conditions.
The imidization reaction can be carried out in either a batch or a continuous process. The batch process is more common, but the continuous process is more efficient.
The film formation process can be carried out using a variety of methods, including casting, spin coating, and extrusion. The casting method is the most common, as it is relatively simple and inexpensive.
So far, the thermal decomposition temperature of our PI is 450°C, the long-term use temperature can reach more than 200°C, and the short-term use above 300°C is acceptable.
Polyimides (PIs) are high-temperature engineering polymers originally developed by the DuPont™ Company. PIs exhibit an exceptional combination of thermal stability (>500°C), mechanical toughness, and chemical resistance. They have excellent dielectric properties and inherently low coefficient of thermal expansion. They are formed from diamines or diisocyanates and dianhydrides such as those shown in the picture.
There is more than one type of polyimide. Today we are going to talk about the polyimide resin and polyimide film. The chart below just shows the comparisons.
Polyimide film could be made from polyimide resin. The resin is first dissolved in a solvent and then cast onto a substrate. The solvent is then evaporated, leaving behind a thin film of polyimide. The film is then annealed, which helps to improve its properties.
The connection between polyimide film and polyimide resin is that they are both made from the same basic materials. The difference is that the film is a thin, flexible sheet, while the resin is a more viscous liquid.
Polyimide film and polyimide resin have many of the same properties. They are both heat-resistant, strong, and chemically resistant. They are also both transparent to a wide range of wavelengths.
However, there are some differences between the two materials. Polyimide film is more flexible than polyimide resin. This is because the film is made from a thinner layer of material. Polyimide resin is also more viscous than polyimide film. This means that it is more difficult to work with.
Polyimide film and polyimide resin are both valuable materials with a wide range of applications. They are used in a variety of industries, including electronics, aerospace, and medical devices.
Reference: https://www.sciencedirect.com/topics/materials-science/polyimide
Polyamide resin and polyimide resin are both types of synthetic polymers with distinct characteristics. Here are the key differences between them:
Chemical Structure:
Polyamide resin: Polyamides have repeating amide (-CONH-) linkages in their molecular structure. They are also known as nylon resins.
Polyimide resin: Polyimides have repeating imide (-CO-N-Ph-N-CO-) linkages in their molecular structure.
Thermal Stability:
Polyamide resin: Polyamides have moderate to good thermal stability, with melting points typically below 300°C.
Polyimide resin: Polyimides have excellent thermal stability and can withstand high temperatures, often exceeding 300°C without significant degradation. They are known for their exceptional heat resistance.
Mechanical Properties:
Polyamide resin: Polyamides offer good mechanical properties, including high strength, toughness, and abrasion resistance. They have relatively good impact resistance.
Polyimide resin: Polyimides exhibit excellent mechanical properties, such as high strength, stiffness, and dimensional stability. They are known for their exceptional tensile strength and modulus.
Chemical Resistance:
Polyamide resin: Polyamides have good resistance to many chemicals, oils, and solvents. However, they may be affected by strong acids and bases.
Polyimide resin: Polyimides have excellent resistance to chemicals, acids, bases, solvents, and most organic compounds. They are highly resistant to degradation from aggressive substances.
Applications:
Polyamide resin: Polyamides are commonly used in various applications, including textiles, engineering plastics, automotive parts, electrical connectors, and consumer goods.
Polyimide resin: Polyimides are widely used in demanding applications that require high-temperature resistance, such as aerospace components, electrical insulation, semiconductors, and high-performance coatings.
It’s worth noting that there are different types of polyamides and polyimides, each with its own variations and specific properties. The differences mentioned above provide a general overview of the contrasting characteristics between these resin types.
So, do you think both of them could be used in the polyimide film?
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Polyimide (PI) resin manufactured by Yangchen Tech is a high-performance synthetic resin that is known for its excellent thermal stability, mechanical properties, chemical resistance, and electrical properties. It is a thermosetting polymer, which means that it cures into a permanent shape when heated.
PI resin is made by reacting an aromatic diamine with an aromatic dianhydride. The resulting polymer has a high molecular weight and a high degree of cross-linking. This gives PI resin excellent thermal and mechanical properties.
PI resin is used in a wide range of applications, including:
Electronics: PI resin is used in the manufacture of printed circuit boards, high-temperature insulation, and connectors.
Aerospace: PI resin is used in the manufacture of aircraft parts, missiles, and satellites.
Chemical processing: PI resin is used in the manufacture of chemical processing equipment, such as pumps, valves, and reactors.
Medical devices: PI resin is used in the manufacture of medical implants, such as heart valves and artificial joints.
PI resin is a versatile material with a wide range of applications. Its excellent thermal and mechanical properties make it ideal for use in harsh environments.
Advantages of Polyimide Resin
Excellent thermal stability: PI resin can withstand temperatures up to 500°C (932°F) without significant degradation.
Good mechanical properties: PI resin is strong, tough, and resistant to impact.
Excellent chemical resistance: PI resin is resistant to a wide range of chemicals, including acids, bases, and solvents.
Good electrical properties: PI resin is a good insulator and has high dielectric strength.
Disadvantages of Polyimide Resin
High cost: PI resin is more expensive than other types of resin.
Difficult to process: PI resin can be difficult to process due to its high viscosity.
Limited availability: PI resin is not as widely available as other types of resin.
Conclusion
Polyimide resin produced by Yangchen Tech is a high-performance material with a wide range of applications. Its excellent thermal and mechanical properties make it ideal for use in harsh environments. However, PI resin is also more expensive and difficult to process than other types of resins.
If you are looking for a high-performance material that can withstand extreme conditions, then polyimide resin is a good option. However, if you are looking for a more cost-effective and easy-to-process material, then you may want to consider other types of resins.
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