Polyimide resin PI-100
Ⅰ.Product Description
PI-100 is one of the advanced composite matrix resin varieties, widely used in high-performance, high-temperature-resistant resin-based composites, can replace the Kerimid 601 polyimide resin. It is mainly used as bonding agent for grinding wheels and friction materials (diamond, cubic boron nitride) and matrix resin for high-temperature-resistant molded parts, and it is also suitable for the preparation of high (low) temperature-resistant solid self-lubricating mechanical parts.
Ⅱ.Characteristic
PI-100 has the advantages of high glass transition temperature, excellent heat resistance and mechanical Characteristics, excellent electrical Characteristics, good storage stability. PI-100 is hot compression molding, can also be dissolved with organic solvents (DMF, etc.) to prepare fiber (glass fiber, carbon fiber, etc.) reinforced prepreg. After dissolving and mixing with different epoxy resins, a variety of heat-resistant grade new epoxy resin system can be prepared to meet the requirements of different composite materials and electrical insulation materials on the heat-resistant Characteristics of epoxy resins.
Appearance
Melting point
Particle size
Flowability
Gel time 200℃
Yellow powder
80-110℃
200-1000 mesh
8-20mm
100-600 S
Ⅲ.Application
(1) Mainly used as bonding agent for grinding wheels (diamond, cubic boron nitride) and friction materials, as well as matrix resin for high temperature molded parts, with excellent heat resistance and mechanical Characteristics.
(2) It can be used to manufacture high (low) temperature resistant solid self-lubricating mechanical parts.
(3) Dissolved in organic solvents (DMF, etc.) to become a certain solid content of the resin liquid, can be used to manufacture fiber (glass fiber, carbon fiber, etc.) reinforced prepreg, in the field of high temperature resistant matrix resin composite materials are widely used.
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