In advanced materials engineering, N‑phenylmaleimide (N‑PMI) manuafctured by Yangchen Tech has emerged as a high‑performance monomer for imparting exceptional heat resistance, dimensional stability, and mechanical robustness to a wide range of polymer composites. By introducing a rigid five‑membered maleimide ring with a phenyl substituent, N‑PMI elevates thermal decomposition thresholds, raises Vicat softening points, and improves tensile and flexural properties across ABS, PVC, Nylon 6, epoxy, and polyimide systems. 

Why choose N‑Phenylmaleimide?

N‑Phenylmaleimide features a planar cyclic imide core that resists chain scission at elevated temperatures, pushing onset decomposition temperatures 20–30 °C higher than conventional styrenic copolymers . Its phenyl ring further imparts steric hindrance, reducing segmental mobility and boosting glass transition temperatures (Tg) by up to 15 °C in polymer blends .

Specification

Basic Information

Chemical Structure
Chemical Formula	C10H7NO2
CAS No.	941-69-5
Molecular Weight	173.16
Packing Type	Paper bag (20 kg)
Properties	Yellow crystalline powder or needles

Core Applications in Polymer Composites

• ABS Composites  

In ABS/NSM (N‑PMI‑styrene‑maleic anhydride) terpolymers, just 10 wt % N‑PMI elevates heat distortion temperatures (HDT) from ~100 °C to 130 °C, while also increasing tensile strength by 10–15 % and Rockwell hardness by 20 % . Such improvements enable under‑the‑hood automotive parts to maintain dimensional integrity under prolonged high‑temperature exposure .

• PVC & PMMA Systems  

In PVC‑ABS blends, N‑PMI acts as both a heat‑stabilizer and flame‑retardant, helping formulations meet UL‑94 V‑0 ratings by reducing thermal oxidation and dripping under fire tests .Similarly, incorporating 5–15 wt % N‑PMI in PMMA raises Vicat softening points by 10–20 °C, enhancing optical disc substrates and lighting components for sustained high‑temperature service.

• Epoxy & Electronics  

When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.

Mechanisms of Heat‑Resistance Enhancement  

1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points.

2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .  

3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems .

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